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In this world of fast growing electronics technology & miniaturization process, thousands of new portable and light weight electronics products are launched in the market each day and in various fields of electronics such as - consumer electronics , medical electronics , communication electronics , defence electronics , industrial electronics and in aerospace electronics . Due to complex circuit design & miniaturization , excessive amount of heat dissipation is happening in electronics products which is reducing the life-span of the components/devices .Thus thermal management of all electronics products has become an important issue . In this role of thermal management, "electronics packaging" plays a very important part .

Here in this short course you will study in detail about the "advanced materials used in electronics packaging" & "thermal management materials' that has been developed over the recent years.

What you will learn in this course ???????

What is electronics packaging

Why we need electronics packaging

6 Hierarchy in electronics packaging

3 Packaging variations

7 different types of packaging configurations & their applications

Different types of substrate materials

What is so great about FR4 board

Difference between FR1/2/3 & FR4 board properties

Materials used to form electronic glass substrate and application of electronic glass

In-depth knowledge on ceramic substrate materials

GELVET TIM technology

Metal matrix composite (MMCS) materials : Al-Si , Al-SiC ,Cu-Diamond , Al-Diamond , Gold-Gold Interconnections (GGI) & Al-Graphite composite

Technical details on Carbon Nano Tube (CNTS)

PCM materials

Electro-magnetic-interference (EMI) shielding materials

At the end of this course , a RESOURCE File is provided which will help you a lot in further understanding of the topics given in this course .